Photoinitiated Vinyl Addition Polymerized (Photo-VAP) Norbornene Resins for 3D Printing
Authors: K. Cushman, G. Deng, K. Manal, M. Yarolimek, C. Cipkar, S. Jockusch, L. Rhodes, S. Jayarama
Journal:Chemical Communications
Year: 2025
Abstract: Light-initiated norbornene vinyl addition polymerization (norbornene photo-VAP) can be achieved in a matter of seconds using a palladium precatalyst, photoacid generator (PAG) and photosensitizer (PS). This system provides high conversion and fast cure time making it suitable for light-initiated 3D printing. Photophysical studies of the system revealed insights in understanding this highly efficient formulation for high Tg norbornene photo-VAP resins. Read More
Ruthenium Catalyzed Photo-ROMP Activated by a Chlorine Functional Thioxanthone (CPTX)
Authors: K. Manal, S. Jockusch, O. Burtovyy, L. Zhang, L. Langsdorf, A. Niemiec, D. Gastaldo, D. Skilskyj, M. Chwalba, L. Rhodes, S. Jayaraman
Journal: Photochemistry and Photobiology A: Chemistry
Year: 2025
Abstract:Photophysical features of light-initiated ring opening metathesis polymerization (Photo-ROMP) of cyclic olefins utilizing a novel formulation containing a Ru precatalyst and 1-chloro-4-isopropoxythioxanthone (CPTX) is evaluated. Our studies support the hypothesis that the activation of the Ru precatalyst employed in the formulation is driven by the in situ generation of HCl from the photolysis of CPTX leading to polymerization of the cyclic olefin monomer (HexylTD) to polymer in a few seconds. Read More
Properties of Cyclic Olefin-Based Photo-ROMP Resins Suitable for DLP 3D Printing Applications
Authors: S. Burtovyy, K. Cushman, G. Meyer, L. Zhang, A. Niemiec, D. Gastaldo, D. Skilskyj, K. Skowerski, L. Rhodes
Journal: Materials Advances
Year: 2025
Abstract: A series of cyclic olefin monomers, all based on derivatives of tetracyclododecene with different pendant groups, were evaluated as suitabile candidates for photo-ROMP resins using a latent Ru precatalyst activated by a chlorinated thioxanthone (CPTX, 1-chloro-4-propoxythioxanthone) when exposed to purple light. Two monomers where the pendant group was hexyl or phenethyl are non-flammable and exhibited low volatility and odor. The thermomechanical properties of these two resins were determined after flood photo-curing.... Read More
Synthesis of a Neutral Palladium Water Complex Supported by a Bulky Phosphine Ligand
Authors: S. Hayakawa, H. Burgoon,L. Rhodes, S. Gaire, C. Ziegler
Journal: Inorganica Chimica Acta
Year: 2024
Abstract: Addition of one equiv of the bulky phosphine, P(1-adamantyl)2(n-butyl) (P(1-Ad)2(n-Bu)), to palladium(II) acetate ([Pd(OAc)2]) in the presence of water gave high yields of a neutral mononuclear palladium diacetate water complex supported by a single phosphine ligand, [Pd(H2O)(OAc)2(P(1-Ad)2(n-Bu))] (1). In the solid state, a single crystal X-ray study of 1 revealed trans acetate ligands exhibiting intermolecular hydrogen bonding between the protons of the coordinated water and the acetate ligand’s carbonyl oxygen bonded to a neighboring Pd center.... Read More
Polymerization of Ester-Functionalized Norbornenes Using Neutral Nickel Catalysts
Authors: E. Powell, R. Mimna, C. Day, V. Day, B. Long, L. Rhodes
Journal: Organometallics
Year: 2024
Abstract: Addition-type polynorbornenes have shown tremendous promise for a variety of applications; however, the direct polymerization of polar functionalized monomers is often challenging when using transition metal-based catalysts. This result is often ascribed to the oxophilic nature of many early transition metal species.This result is often ascribed to the oxophilic nature of many early transition metal species. Strategies to overcome this issue include the use of late transition metal catalysts,such as those containing Ni and Pd active sites.... Read More
Synthesis of a Palladium Dimer Supported by a C-Bound Trifluoroacetonate Bridge Formed by Cleavage of a Hexafluoroacetyl- acetonate Ligand
Authors: P. Byrne, H. Burgoon, J. Koester, W. Chen, C. Ziegler, E. Tuca, G. DiLabio, L. Rhodes
Journal: Organometallics
Year: 2024
Abstract: Palladium(II) hexafluoroacetylacetonate (Pd(Hfacac)2) is known to form adducts of bases, such as lutidine (2,6-dimethylpyridine). When treated with approximately 3 equiv of lutidine, Pd(Hfacac)2 yields a 1:1 complex as reported in the literature, Pd(O,O-Hfacac)(C-Hfacac)(lutidine),1. However, when the amount of excess lutidine is increased, a new complex, 2, is formed. A single-crystal X-ray structure of 2 proves it is a rare example of a dimeric palladium complex... Read More
Crosslinking Vinyl-Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric-Constant and Low Dielectric-Loss Thermosets
Authors: P. Kandanarachchi, G. Meyer, S. Musolino, J. Wulff, L. Rhodes
Journal: Macromolecular Rapid Communications
Year: 2024
Abstract: Thermosets having low dielectric constant (Dk < 3) and low dielectric dissipation factor (Df < 0.003), high glass transition temperature (Tg > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high Tg vinyl-addition polynorbornene resin: poly(5-hexyl-1-norbornene) (poly(HNB)).... Read More
Interchain Ordering Structure and Main Chain Conformation Analysis of Thermal Stability in Vinyl-Addition Polynorbornene
Authors: H. Kai, A. Izumi, S. Hayakawa, A. Niemiec, C. Ebner, M. Schofield, D. Skilskyj, L. Rhodes
Journal: Polymer
Year: 2022
Abstract: The aggregation structure and formation mechanism during film casting using toluene of vinyl-addition poly(norbornene-co-hexylnorbornene)s (P(NB/HNB)s) synthesized using Ni and Pd catalyst were systematically investigated by wide- and small-angle X-ray scattering and gel permeation chromatography–right-angle laser light scattering–viscometry techniques. The correlation of these data with the glass-transition temperature (Tg) was discussed. Read More
Photopatterning of Low Dielectric Constant Cycloolefin Polymers Using Azides and Diazirines
Authors: H. Burgoon, C. Cyrus, D. Skilskyj, J. Thoresen, C. Ebner, G. Meyer, P. Filson, L. Rhodes, T. Backlund, A. Meneau, T. Cull, I. Afonina
Journal: Applied Polymer Materials
Year: 2020
Abstract: Polymers are widely used as insulators in electronic devices. Low dielectric constant polymers are desirable since this lowers the potential for unintentional crosstalk and inductive coupling between conductors. Attempts to photo-pattern a low dielectric constant polymer, poly(5-hexyl-2-norbornene) (poly(1)), with a bis(azide) were unsuccessful. Incorporation of butenyl pendent groups improved patterning, but the dielectric constant of the crosslinked film was relatively high (2.60). Read More
Formation of Phenoxynorbornane Pendant Groups by Acid-Catalyzed Hydroalkoxylation of Poly(hydroxystyrere) and Its Application to Photopatterning
Authors: C. Cyrus, H. Kamel, H. Burgoon, J. Rhodes, J. Thoresen, G. Meyer, L. Paudel, P. Filson, L. Rhodes
Journal: Applied Materials and Interfaces
Year: 2019
Abstract: Poly(hydroxystyrene) (PHS) reacts with norbornene in the presence of acid to form a phenoxynorbornane pendent group through the hydroalkoxylation of the norbornene double bond by the phenol −OH group of PHS. Films of PHS, an aqueous base soluble polymer, containing norbornene derivatives and a photoacid generator (PAG) create a negative tone photopatternable composition. Acid generated in the exposed regions of the film promotes the hydroalkoxylation reaction... Read More
Latent, UV-activated ROMP Catalyst System
Authors: O. Burtovyy, L. Zhang, L. Langsdorf, A. Niemiec, D. Gastaldo, K. Skowerski, L. Rhodes
Journal: Presented at ISOM23, Barcelona
Year: 2019
Abstract: Read More
Sugar-Functional Vinyl Addition Poly(norbornene)-Photopatternable Poly(norbornenyl gluconamide) Compositions Developed with Water
Authors: S. Smith, L. Paudel, C. Cyrus, H. Burgoon, K. Fujita, J. Thoresen, K. Thomas, L. Langsdorf, L. Rhodes
Journal: ACS Omega
Year: 2018
Abstract: The norbornenyl gluconamide (NBGA) monomer can be polymerized by a number of palladium catalysts to give water-soluble, vinyl addition poly(NBGA). Depending on the catalyst used, the reaction conditions, and the chain-transfer additives employed, high-molecular-weight polymers can be obtained. These polymers can be thermally cross-linked at ca. 190 °C or at ca. 150 °C when the difunctional glutaraldehyde is added. Read More
Polymers of norbornenyl-4-phenol: Dissolution rate characteristics, positive tone photo-patterning, and polymer properties
Authors: P. Evans, C. Brick, A. Bell, P. Kandanarachchi, J. Thoresen, L. Rhodes, O. Onishi, H. Ikeda, G. Benedikt, E. Koronich
Journal: Applied Polymer Science
Year: 2017
Abstract: Vinyl addition norbornene polymers with phenol pendent groups are obtained by methanolysis of the 4-acetoxyphenyl norbornene polymer. Thin films of this polymer blended with additives such as norbornene polymers with hexafluoroalcohol pendent groups and diazonaphthoquinone compounds result in linear dissolution in tetramethylammonium hydroxide developer. Good resolution, positive tone patterns are obtained from image-wise exposure of thin films of blends of the diazonaphthoquinone additives... Read More
The Effect of endo/exo-Norbornene Isomer Ratio on Poly(norbornene) Optical Density at 193 nm
Authors: C. Chang, A. Bell, R. Shick, L. Seger, L. Rhodes, G. Benedikt
Journal: Photopolymer Science and Technology
Year: 2014
Abstract:The polymerization of exo-[(norbornenemethoxy)methyl]-1,1,1,3,3,3-hexafluoro-2-propanol (2) using a palladium catalyst gave a significantly higher Mw polymer than the endo isomer or the 80/20 mixture of endo/exo-2. To achieve similar Mw higher concentrations of formic acid chain transfer agent was needed for the exo isomer than for the 80/20 mixture. As a result, the optical density at 193 nm of the exo isomer polymer is substantially lower since less olefinic polymer end groups were formed. Read More
Palladium Catalyzed Vinyl Addition Poly(norbornenes): Formic Acid as a Chain Transfer Agent. Mechanism and Polymer Optical Properties
Authors: P. Kandanarachchi, C. Chang, S. Smith, P. Bradley, L. Rhodes, R. Lattimer, G. Benedikt
Journal: Photopolymer Science and Technology
Year: 2013
Abstract:Polymers of substituted norbornenes were produced using palladium catalysts in the presence of formic acid (FA) as a chain transfer agent (CTA) which act to control molecular weight as well as to increase conversion. Spectroscopic analysis of these polymers by H-1 NMR and MALDI-TOF MS confirmed that hydrogen-terminated polynorbornenes are generated leading to extremely low optical densities at 193 nm. Read More
Palladium Catalyzed Vinyl Addition Poly(norbornenes): Silane Chain Transfer Agents, Hydroxyl Group Activators and Their Impact on Optical Density at 193 nm
Authors: C. Chang, D. Barnes, L. Seger, L. Rhodes, R. Lattimer, G. Benedikt
Journal: Photopolymer Science and Technology
Year: 2012
Abstract: Polymers of substituted norbornenes were produced using palladium catalysts in the presence of silane chain transfer agents (CTA) which act to control molecular weight. Yields were dramatically increased by addition of hydroxylic reagents such as ethanol. Spectroscopic analysis of these polymers by 1H NMR and MALDI-TOF MS confirmed the hydrogen-terminated polynorbornenes are generated leading to extremely low optical densities at 193 nm. Read More
Optical Density at 193nm of Vinyl Addition Poly(norbornene) Made Using Hydrogen as a Chain Transfer Agent
Authors: C. Chang, J. Lipian, C. Burns, L. Rhodes, R. Lattimer
Journal: Photopolymer Science and Technology
Year: 2010
Abstract:Homopolymers of a bis-trifluorocarbinol substituted norbornene (1) (α,alpha;-bis(trifluoromethyl)bicyclo[2.2.1]hept-5-ene-2-ethanol or HFANB) were produced using a palladium catalyst and hydrogen as a chain transfer agent to control molecular weight. As the hydrogen pressure increased, the molecular weight of poly(l) decreased. Spectroscopic analysis of these polymers by 1H NMR and MALDI-TOF MS confirmed that the hydrogen chain transfer agent generated hydrogen-terminated vinyl addition homopolymers of 1. Read More
A SI-CMOS-MEMS Process Using Back-Side Grinding
Authors: Y. Fang, A. Wung, T. Mukherjee, G. Fedder
Journal: MEMS
Year: 2010
Abstract:This paper presents a Si-CMOS-MEMS fabrication process which leaves the back-side silicon under the CMOS metal and oxide layers, and improves the uniformity of the back-side silicon using back-side grinding. The Si-CMOS-MEMS process includes a grinding process followed by a bonding process and conventional post-CMOS etch. A Si-CMOS-MEMS accelerometer is used to demonstrate the feasibility of the Si-CMOS-MEMS process. Read More
Patterning desomposable polynorbornene with electro beam lithography to create nanochannels
Authors: N. Devlin, D. Brown, P. Kohl
Journal: Vacuum Science and Technology
Year: 2009
Abstract:Unity® 4671E sacrificial material is a decomposable negative tone polymer sensitive to ultraviolet radiation. In this study, it is shown that Unity® 4671E can also be patterned by electron beam lithography. Nanochannels with a width of 65 nm and a pitch of 200 nm have been fabricated. The developed Unity® 4671E patterns can thermally decompose and the products can permeate through the encapsulating material leaving nanocavities. Read More
Low Temperature Curable Polynorbornene as Redistribution Layer
Authors: B. Knapp, E. Takeuchi, J. Kusunoki, S. Ohashi, C. Apanius, E. Elce, H. ng
Journal: Presented at The Thirtheenth Meeting of The Symposium on Polymers for Microelectronics
Year: 2008
Abstract: Read More
β, γ-Carbon−Carbon Bond Cleavage as a Prelude to Chain Transfer in Ester-Functionalized Norbornene Polymerization
Authors: J. McDermott, C. Chang, F. Martin, L. Rhodes, G. Benedikt, R. Lattimer
Journal: Macromolecules
Year: 2008
Abstract:Nuclear magnetic resonance (NMR) and matrix-assisted laser desorption ionization time-of-flight mass spectroscopy (MALDI-TOF MS) was used to study the nature of of ester-functionalized nanobornene polymerization and its chain transfer mechanism. The molecular ions are found to be consistent with a polymer series with a norbornenyl end group while the end group exhibit only one olefinic proton resonance. The end-group structure containing two double bonds is proposed to be more consistent with the NMR spectra. Read More
Development of Optically Transparent Cyclic Olefin Photoresist Binder Resins
Authors: L. Rhodes, C. Chang, C. Burns, D. Barnes, B. Bennett, L. Seger, X. Wu, A. Sobek, M. Mishak, C. Peterson, L. Langsdorf, H. Hada, H. Shimizu, K. Sasaki
Journal: Advances in Resist Technology and Processing XXII
Year: 2005
Abstract: Of all candidate 193 nm photoresist binder resins, transition metal catalyzed vinyl addition cyclic olefin (i.e., norbornene) polymers (PCO) hold the promise of high transparency and excellent etch resistance. In order to access lower molecular weight polymers, which a typically used in photoresists, alpha-olefin chain transfer again (CTAs) are used in synthesizing vinyl addition poly(norbornenes). Read More
The Effect of End Group Modification on the Transparency of Vinyl Addition Norbornene Polymers at 193 nm
Authors: C. Chang, J. Lipian, D. Barnes, L. Seger, C. Burns, B. Bennett, L. Bonney, L. Rhodes, G. Benedikt, R. Lattimer, S. Huang, V. Day
Journal:Macromolecular Chemistry and Physics
Year: 2005
Abstract:Homopolymers of a bis-trifluorocarbinol substituted norbornene (1) (a,a-bis(trifluoromethyl)bicyclo[2.2.1]-hept-5-ene-2-ethanol or HFANB) and copolymers of 1 with t-butyl ester of 5-carboxylic acid (2, t-BuEsNB) were produced using palladium catalysts and olefinic chain transfer agents such as 1-hexene and ethylene to control molecular weight. However, these low-molecular-weight polymers exhibited relatively low optical transparencies at 193 nm. Read More
Improved Fabrication of Micro Air-Channels by Incorporation of a Structural Barrier
Authors: P. Joseph, H. Kelleher, A. Bidstrup-Allen, P. Kohl
Journal:Micromechanics and Microengineering
Year: 2004
Abstract:The fabrication of air-channels for microelectromechanical systems and microfluidic devices using polynorbornene and polycarbonates as thermally or photolitically decomposable materials to form air-gaps in dielectric materials has been reported. In this study, the incompatibility of some overcoat polymers with the sacrificial materials was addressed. SiO2 was used as a barrier layer for the fabrication of single- and multi-layer air-channels via different sacrificial and overcoat materials. Read More
Fluoropolymer Resists: Fundamentals and Lithographic Evaluation
Authors: H. Ito, H. Truong, L. Rhodes, C. Chang, L. Langsdorf, A. Sidaway, K. Maeda, S. Sumida
Journal:Photopolymer Science and Technology
Year: 2004
Abstract:Hexafluoroisopropanol (HFA) extensively utilized in the design of 157 nm resists provides attractive but complex dissolution characteristics. Poly(norbornene hexafluoroalcohol) (PNBHFA), which is equivalent to polyhydroxystyrene for 248 nm lithography, exhibits linear dissolution kinetics in 0.26 N tetramethylammonium hydroxide (TMAH) aqueous solution while weaker developers could induce swelling, resulting in multi-stage dissolution. Read More
Bis(trifluoromethyl)carbinol-Substituted Polynorbornenes: Dissolution Behavior
Authors: T. Hoskins, W. Chung, A. Agrawal, P. Ludovice, C. Henderson, L. Seger, L. Rhodes, R. Shick
Journal:Macromoles
Year: 2004
Abstract:Alicyclic polymers, such as substituted polynorbornene (PNB), are expected to be one potential material solution for providing transparent photoresist polymer resins for photolithography at 193 and 157 nm wavelengths. In this work, the dissolution behavior of bis(trifluoromethyl)carbinol-substituted polynorbornene (HFAPNB) in aqueous alkaline solutions as a function of polymer molecular weight is explored. Surprisingly, it was found that the dissolution rate of bis(trifluoromethyl)carbinol-substituted polynorbornene increased... Read More
Recent Progress on New Fluorinated Resins for 157 nm Lithography
Authors: F. Houlihan, R. Sakamuri, D. Rentkiewicz, A. Romano, R. Dammel
Journal:Advances in Imaging Materials and Processes
Year: 2004
Abstract:As part of a new generation of more transparent 157 nm resist platforms we are developing, a novel resist system is described that has higher transparency and contrast than AZ®FX™ 1000P. Using a new protecting group strategy, encouraging results have been obtained with both poly(α,α- bis(trifluoromethyl)bicyclo(2.2.1)hept-5-ene-2-ethanol) and a more transparent perfluorinated resin (TFR). Read More
Dissolution Rate Modifiers Based on Oligomeric Norbornene Derivatives for Use in Chemically Amplified Cyclic Olefin Resists
Authors: L. Seger, C. Chang, X. Wu, D. Barnes, L. Rhodes, T. Hoskins, A. Jeyakumar, C. Henderson, R. Dammel
Journal:Advances in Imaging Materials and Processes
Year: 2004
Effect of Photoacid Generator Additives on the Dissolution Behavior of Bis-trifluoromethly Carbinol Substituted Polynorbornene
Authors:T. Hoskins, C. Berger, P. Ludovice, C. Henderson, L. Seger, C. Chang, L. Rhodes
Journal:Advances in Resist Technology and Processing XXI
Year: 2004
Abstract:Summary: Alicyclic polymers, such as substituted polynorbornenes, are one potential material solution for providing photoresist polymer resins with high transparency backbones for photolithography at 193 nm and 157 nm wavelengths. In addition, the bis-trifluoromethyl carbinol functional group has been identified as a highly transparent base soluble group that can be used for producing photoresist resins from polynorbornene materials for 157 nm lithography. Read More
Sythesis and Nonlinear-Optical Properties of Vinyl-Addition Poly(norbornene)s
Authors: K. Park, R. Twieg, R. Ravikiran, L. Rhodes, R. Shick, D. Yankelevich, A. Knoesen
Journal:Macromoles
Year: 2004
Abstract:Vinyl-addition poly(norbornene) copolymers functionalized with nonlinear optical chromophore side groups have been prepared using (η6-toluene)Ni(C6F5)2, and their electrooptic properties have been characterized. The nickel complex used to polymerize the norbornene monomers is tolerant to many functional groups found in nonlinear optical chromophores although nitriles and amines other than trisubstituted amines strongly inhibit the reaction. Read More
Fabrication of Microchannels Using Polynorbornene Photosensitive Sacrificial Materials
Authors: X. Wu, H. Reed, Y. Wang, L. Rhodes, E. Elce, R. Ravikiran, R. Shick, C. Henderson, A. Bidstrup-Allen, P. Kohl
Journal:The Electrochemical Society
Year: 2003
Abstract: A processing method has been demonstrated for the fabrication of microchannels using photosensitive polynorbornene copolymer based sacrificial materials. The channel geometric patterns of sacrificial polymer were made via photolithography. The sacrificial polymer patterns were encapsulated with a dielectric medium and then thermally decomposed to form air channels. Read More
High Performance Plastic Substrates for Active Matrix Flexible FPD
Authors: S. Angiolini, M. Avidano, R. Bracco, C. Barlocco, N. Young, M. Trainor, X. Zhao
Journal:Digest of Technical Papers
Year: 2003
Abstract: AppearTM 3000 and AryLiteTM plastic films satisfy most of the necessary requirements for use as substrates in flexible flat panel displays. Preliminary evaluations have shown excellent physical and optical properties and chemical resistance. We now present further progress with respect to poly-Si TFT array fabrication. Read More
New Fluorinated Resins for 157 nm Lithography Application
Authors: F. Houlihan, A. Romano, D. Rentkiewicz, R. Sakamuri, R. Dammel, W. Conley, G. Rich, D. Miller, L. Rhodes, J. McDaniels, C. Chang
Journal:Photopolymer Science and Technology
Year: 2003
Abstract: As part of a new generation of more transparent 157 nm resist platforms we are developing, a novel resist system is described that has higher transparency and contrast than AZ®FX™ 1000P. Using a new protecting group strategy, encouraging results have been obtained with both poly(α,α-bis(trifluoromethyl)bicyclo[2.2.1]hept-5-ene-2-ethanol) and a more transparent perfluorinated resin (TFR). Read More
Rational Design in Cyclic Olefin Resists for Sub-100nm Lithography
Authors: W. Li, L. Rhodes, L. Langsdorf
Journal:Microlithography Presentation
Year: 2003
Abstract: Read More
High-Performance Plastic Substrates for Flexible Flat Panel Displays
Authors:S. Angiolini, M. Avidano, C. Barlocco, R. Bracco, J. Bacskay, J. Lipian, P. Neal, L. Rhodes, R. Shick, X. Zhao, G. Freeman
Journal:Proc. Eurodisplay
Year: 2002
Abstract: New high-temperature (Tg>300 ºC) optical polymers are under development by Ferrania S.p.A and Promerus, LLC. Substrates based on these materials demonstrate excellent chemical resistance, low O2 permeability and superb physical and optical properties. These properties offer the potential of meeting therequirements for roll-to-roll processing of flat panel displays. Read More
SoL-Compliant Wafer-Level Package Technologies.
Authors:M. Bakir, A. Mule, H. Thacker, P. Kohl, K. Martin, J. Meindl
Journal:Semiconductor International
Year: 2002
Abstract: Sea of leads (SoL), a novel ultrahigh-density packaging technology designed to meet future chip-to-module interconnection needs, enhances the manufacturing cycle’s tail-end-of-line phase by driving down cost and increasing testing efficiency. Read More
Fabrication of Air-Channel Structures for Microfluidic, Microelectromechanical, and Microelectronic Applications
Authors:D. Bhusari, H. Reed, M. Wedlake, A. Padovani, A. Bidstrup-Allen, P. Kohl
Journal:MEMS
Year: 2001
Abstract: A method is presented for fabricating micro-air-channel structures encapsulated by a dielectric material using a sacrificial polymer based on polynorbornene (PNB) chemistry. A spin-coated film of PNB was patterned to define the exact geometry of the air-channels using conventional lithographic and etching techniques. The sacrificial polymer was encapsulated with a permanent dielectric material Read More
Air-Gaps in 0.3 um Electrical Interconnections.
Authors:P. Kohl, D. Bhusari, M. Wedlake, C. Case, F. Klemens, J. Miner, B. Lee, R. Gutmann
Journal:IEEE Electron Device Letters
Year: 2000
Abstract: A copper/air-gap interconnection structure using a sacrificial polymer and SiO2 in a damascene process has been demonstrated. The air-gap occupies the entire intralevel volume with fully densified SiO2 as the planar interlevel dielectric. Read More
Mulitlayer Electron-Beam Curing of Polymer Dielectric for Electrical Interconnections
Authors:R. Manepalli, K. Farnsworth, A. Bidstrup-Allen, P. Kohl
Journal:Electrochemical and Solid-State Letters
Year: 2000
Abstract: Electron-beam curing of a low dielectric constant polymer was investigated as an alternative process to conventional thermal curing for microelectronic interconnection applications. Electron-beam irradiation was used to cross-link polynorbornene, which was formulated so that no thermal cross-linking occurred. It was found that the electron-beam exposure made the polymer solvent resistant, and improved surface planarity in a multilayer structure. Read More
Microstructure of 2,3 Erythro Di-isotactic Polynorbornene from Atomistic Simulation
Authors:S. Ahmed, P. Ludovice, P. Kohl
Journal:Computational and Theoretical Polymer Science
Year: 2000
Abstract: A new RIS model was developed for erythro di-isotactic polynorbornene that included long-range steric interactions that are needed to properly model its conformation. These interactions were included by extracting RIS states from an approximate energy state map for the heptamer of this polymer. Read More
Functionalized Polynorbornene Dielectric Polymers: Adhesion and Mechanical Properties
Authors:N. Grove, P. Kohl, A. Bidstrup-Allen, S. Jayaraman, R. Shick
Journal:Polymer Science
Year: 1999
Abstract:Within the microelectronics industry, there is an ongoing trend toward miniaturization coupled with higher performance. High glass-transition temperature polynorbornenes exhibit many of the key performance criteria necessary for these demanding applications. However, homopolynorbornene exhibits poor adhesion to common substrate materials, including silicon, silicon dioxide, aluminum, gold, and copper. Read More
Avatrel™ Dielectric Polymers for HDP Applications
Authors:W. McDougall, S. Farling, R. Shick, S. Glukh, S. Jayaraman, L. Rhodes, R. Vicari, P. Kohl, A. Bidstrup-Allen, P. Chiniwalla
Journal:"Proceedings of International Conference & Exhibition on High Density Interconnect and Systems Packaging, IMAPS"
Year: 1999
Abstract: In order to realize the performance advancements in silicon technology, complementary advances in packaging technology are necessary. Advance materials must be developed to achieve the full potential of advance packaging processes. A family of dielectric polymers based on polynorbornene is under development to address the broad needs of high density packaging (HDP). Properties common to this family of materials include a low dielectric constant, low loss tangent, low moisture absorption, good adhesion, and isotropic properties. Read More
High Performance Cyclic Olefins for Wireless Applications
Authors:W. McDougall, A. Shick, S. Jayaraman, B. Goodall, L. Rhodes, P. Kohl, A. Bidstrup-Allen, P. Chiniwalla
Journal:"Wireless Symposium Exhibition"
Year: 1998
Abstract: As wireless approaches become more prevalent, they will increasingly challenge the performance limitations of currently available materials. Therefore, there is a growing need for high performance dielectric materials. Cyclic olefins have been tailored to provide for the high performance dielectric needs of the rapidly growing wireless industry. Read More
Reactive Ion Etching of Silicon Containing Polynorbornenes
Authors:Q. Zhao, P. Kohl
Journal:"The Electrochemical Society"
Year: 1998
Abstract: Silyl ether modified polynorbornene is a new class of dielectric polymer materials of interest in electronic packaging and other applications. This work is focused on the reactive ion etching of polynorbornenes in oxygen, oxygen/fluoroform, and oxygen/fluoroform/argon plasmas. The etch rate, amount and nature of the residue, and etch undercut rate have been investigated for different plasma parameters... Read More
Avatrel™ Dielectric Polymers for Electronic Packaging
Authors:R. Shick, S. Jayaraman, B. Goodall, L. Rhodes, W. McDougall, P. Kohl, A. Bidstrup-Allen, P. Chiniwalla
Journal:"Microelectronics"
Year: 1998
Abstract: Materials for packaging range from metals to ceramics, to organic polymers. Recent industry trends have moved to an ever-increasing adoption of polymer materials as the packaging material of choice for a variety of applications ranging from interlayer dielectrics to passivation layers, to die attach adhesives, to chip encapsulants (both molding and adhesive) and underfill materials to name a few. Read More
Gas Transport Properties of a Series of High Tg Polynorbornenes with Aliphatic Pendant Groups
Authors:K. Dorkenoo, P. Pfromm, M. Rezac
Journal:"Polymer Science"
Year: 1998
Abstract: A study of gas transport properties of novel polynorbornenes with increasing length of an aliphatic pendant group R (CH3 --, CH3 (CH2 )3--, CH3 (CH2 )5--, CH3 (CH2 )9--) has been performed. These polymers were synthesized using novel organometallic complex catalysts via an addition polymerization route Read More
Advanced Materials for Electronic Applications by Polymerization of Cyclic Olefins Using Late Transition Metal Catalysts
Authors:D. Barnes, G. Benedikt, B. Goodall, K. Hullihen, S. Jayaraman, W. McDougall, L. McIotosh III, L. Rhodes, R. Shick, R. Allen, R. DiPietro, D. Hofer, J. Opitz, T. Wallow
Journal:"proceedings of metcon '98"
Year: 1998
Abstract: Read More
Stereochemical Structure-Property Relationships in Polynorbornene From Simulation
Authors:S. Ahmed, A. Bidstrup-Allen, P. Kohl, P. Ludovice
Journal:"Macromolecular Symposium"
Year: 1998
Abstract: Single-chain Monte Carlo simulations of polynorbornene were carried out for three stereochemical isomers. These simulations employed custom force field parameters derived from ab initio and semi-empirical quantum calculations. The scaling of intrinsic viscosity with molecular weight was determined from these simulations. Read More
Air-Gaps for Electrical Interconnections
Authors:P. Kohl, Q. Zhao, K. Patel, D. Schmidt, A. Bidstrup-Allen, R. Shick, S. Jayaraman
Journal:"Proceedings of International Conference & Exhibition on High Density Interconnect and Systems Packaging, IMAPS"
Year: 1998
Abstract: The fabrication of air-gap structures for electrical interconnections has been demonstrated using a sacrificial polymer encapsulated in conventional dielectric materials. The air-gap is formed by thermally decomposing the sacrificial polymer and allowing the by-products to diffuse through the encapsulating dielectric. The diffusivity of the polymer decomposition products is adequate at elevated temperatures to allow the formation of an air-gap. Read More
