Materials
Avatrel® 2585P: Avatrel® 2585P is a negative tone photodefinable electronic material that uses typical polyimide solvent developers and is designed to have a very low stress and to be imaged up to 100 microns thick. This material offers a unique set of properties including:- Excellent adhesion to Si, SiO2, Si3N4, SiON, Al, Cu, Au, polyimide, polybenzoxazole and BCB. JEDEC Level III reliability testing was validated with no delamination
- Dielectric constant of 2.5 (50 MHz)
- Glass transition temperature above 250°C
- Tensile Modulus of 0.8 GPa
- Moisture absorption of 0.07%
- Low temperature cure (* 160°C for 1 hour)
- Residual stress on wafer < 4 MPa (current detection limit)
- Very good coating uniformity
- Uses polyimide solvent developers
- Thermal cycling –55°C to 150°C, 2000 cycles, no cracking and no delamination
- Sloped via sidewalls
- High temperature reflow resistance (up to 365°C)
Avatrel® 2095P: Avatrel® 2095P, is a negative-tone, photo-imageable dielectric material designed to have very low stress and to be imaged up to 100 microns thick. This material offers a unique set of properties including:
- Excellent adhesion to Si, SiO2, Si3N4, SiON, Al, Cu, Au, polyimide, polybenzoxazole and BCB. Reliability testing was 168 hours HAST (121°C, 2-atm, 100% RH) with no delamination
- Dielectric constant of 2.5 (50 MHz)
- Glass transition temperature above 250°C
- Tensile Modulus of 0.5 GPa
- Moisture absorption of 0.13%
- Low temperature cure (* 160°C for 1 hour)
- Residual stress on wafer < 4 MPa (current detection limit)
- Environmentally friendly, bio-degradeable solvent for development
- Thermal cycling –55°C to 150°C, 1000 cycles, no cracking and no delamination
Avatrel® 2580P: Avatrel® 2580P is a negative tone photodefinable structural material that uses typical polyimide solvent developers designed to have a very low stress and to be imaged up to typical thickness’ of 20 & 40 microns thick. This material offers a unique set of properties including:
- Excellent adhesion to SiO2, Si3N4, SiON, Al, polyimide, polybenzoxazole and BCB. Reliability testing was 168 hours HAST (121°C, 2-atm, 100% RH) with no delamination
- Dielectric constant of 2.5 (50 MHz)
- Glass transition temperature above 250°C
- Tensile Modulus of 1.56 GPa
- Moisture absorption of 0.06%
- Low temperature cure (* 160°C for 1 hour)
- Residual stress on wafer < 4 MPa (current detection limit)
- Very good coating uniformity
- Uses polyimide solvent developers
- Thermal cycling –55°C to 150°C, 200 cycles, no cracking and no delamination