Promerus is actively developing a family of sacrificial materials that can be removed by a thermal decomposition process.  These materials decompose to gases which are easily vented and can even diffuse through solid overcoats. Semiconductor and MEMS developers can use these materials in a multitude of applications including making fully encapsulated air cavities, building microstructures, protecting devices during wafer processing, and temporarily bonding wafers. Several grades are under development, including ones that decompose at high and low temperatures (~400°C and ~200°C, respectively) as well as ones that are photo-definable. These materials are currently being sampled to selected partners.  Please contact us to discuss your application and potential partnership.