News
Promerus Helps to Build a House October 23, 2008
Promerus employees volunteered at a local Habitat for Humanity house, helping to complete the drywall and landscaping. This activity is part of Promerus’ service to community.
Promerus Receives President's Award from Parent Company Sumitomo Bakelite, Ltd. May 22, 2008
Sumitomo Bakelite has granted the President’s Award of “Teamwork” to Promerus on May 22, 2008. The award was given for the strong team effort in developing a new polycyclic polyolefin material and transferring it to the production facility.
Promerus Obtains 60th US Patent March 11, 2008
As part of its commitment to a strong intellectual property position, Promerus has obtained US Patent 7,341,818, which is the 60th US patent in its portfolio.
Promerus Receives President's Award from Parent Company Sumitomo Bakelite, Ltd. May 26, 2006
Sumitomo Bakelite has granted the President’s Award of “Significant New Product” to Promerus for commercializing a new polycyclic polyolefin material in a semiconductor application on May 26th, 2006.
Promerus LLC (a subsidiary of Sumitomo Bakelite) has named Dr. Robert Shick as President and Chief Operating Officer, replacing Dr. Malcolm G. Miles, who held both these positions until his retirement in April 2006.
Avatrel appears in Scientific American Article featuring New Methods for Fabricating Polymer Pillars November 2004
Scientific American describes latest electrical and opto-electronic interconnect strategies from Georgia Tech using Avatrel polymers.
Avatrel® Stress Buffer Coatings Unveiled May 6, 2004
Promerus unveils recent advances in its Avatrel® Wafer Level Packaging and Passivation Materials for Low Stress Applications.
The attached was presented on May 6th, 2004, at the Eleventh Meeting of the Symposium on Polymers for Microelectronics at Winterthur.
Promerus Wins Supplier Award August 2004
Quality Milestone! A major strategic contract manufacturing resource for many of the world's leading semiconductor companies, has rated Promerus LLC as its number one supplier of die attach adhesive for Q2 2004.
Promerus provides AprimaTM die attach adhesive for semiconductor packaging applications.
GOALI Project Funded by NSF October 2003
“GOALI: Advanced Photoresist materials for 193 nm and 157 nm Microlithography” is a joint project between PROMERUS LLC and Georgia Institute of Technology. This project aims to develop new polynorbornene based photoresist binder resins to improve technical performance of 193 nm and 157 nm resists. The primary goals of the project are three-fold: (a) to develop a better fundamental understanding of the relationship between polynorbornene resist polymer structure and resulting formulated resist material properties; (b) to develop a better fundamental understanding of the interaction and influence of photoacid generators with the photoresist resin; and (c) to design and characterize dissolution inhibitors for 193 nm and 157 nm photoresists. This is a three-year program and was awarded by NSF in October of 2003.
The 13th International Conference on Photopolymers, in Tamiment PA October 2003
PROMERUS presented a technical paper entitled “Dissolution Rate Modifiers Based on Oligomeric Norbornene Derivatives for Use in Chemically Amplified Cyclic Olefin Resists”. This paper reported dissolution rate modifiers prepared by the oligomerization of norbornene-type monomers containing fluorinated pendant groups.